MayDay Sale → Spare bis zu 60 %
Alles von 6 John Lau auf Taschenbuch und Gebundenes Buch
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erscheint am 24. Mai 2026
![Cover for John Lau · 3D IC Integration and Packaging (Gebundenes Buch) [Ed edition] (2015)](https://imusic.b-cdn.net/images/item/original/060/9780071848060.jpg?john-lau-2015-3d-ic-integration-and-packaging-gebundenes-buch&class=scaled&v=1647908841)
![Cover for John Lau · Through-Silicon Vias for 3D Integration (Gebundenes Buch) [Ed edition] (2012)](https://imusic.b-cdn.net/images/item/original/143/9780071785143.jpg?john-lau-2012-through-silicon-vias-for-3d-integration-gebundenes-buch&class=scaled&v=1647908435)
![Cover for John Lau · Thermal Stress and Strain in Microelectronics Packaging (Taschenbuch) [Softcover reprint of the original 1st ed. 1993 edition] (2012)](https://imusic.b-cdn.net/images/item/original/696/9781468477696.jpg?john-lau-2012-thermal-stress-and-strain-in-microelectronics-packaging-taschenbuch&class=scaled&v=1539207051)
![Cover for John Lau · Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Gebundenes Buch) [Ed edition] (2010)](https://imusic.b-cdn.net/images/item/original/791/9780071753791.jpg?john-lau-2010-reliability-of-rohs-compliant-2d-and-3d-ic-interconnects-gebundenes-buch&class=scaled&v=1647908286)