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![Cover for Y C Lee · Manufacturing Challenges in Electronic Packaging (Taschenbuch) [Softcover reprint of the original 1st ed. 1998 edition] (2012)](https://imusic.b-cdn.net/images/item/original/590/9781461376590.jpg?y-c-lee-2012-manufacturing-challenges-in-electronic-packaging-taschenbuch&class=scaled&v=1433537479)
![Cover for Y C Lee · Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging (Gebundenes Buch) [2007 edition] (2006)](https://imusic.b-cdn.net/images/item/original/749/9780387279749.jpg?y-c-lee-2006-micro-and-opto-electronic-materials-and-structures-physics-mechanics-design-reliability-packaging-volume-i-materials-physics-materials-mechanics-volume-ii-physical-design-reliability-and-packaging-gebundenes-buch&class=scaled&v=1669944797)