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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Brandon Noia Softcover reprint of the original 1st ed. 2014 edition
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Brandon Noia
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.
263 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra
| Medien | Bücher Taschenbuch (Buch mit Softcover und geklebtem Rücken) |
| Erscheinungsdatum | 23. August 2016 |
| ISBN13 | 9783319345345 |
| Verlag | Springer International Publishing AG |
| Seitenanzahl | 245 |
| Maße | 150 × 220 × 10 mm · 454 g |
| Sprache | Deutsch |
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