This large international conference covered advances in engineering technologies and the physical sciences, with contributions on subjects including mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.

546 pages, 10 Tables, color; 250 Illustrations, black and white; X, 546 p. 250 illus.

Medien	Bücher Taschenbuch (Buch mit Softcover und geklebtem Rücken)
Erscheinungsdatum	7. Juni 2018
ISBN13	9789811093265
Verlag	Springer Verlag, Singapore
Seitenanzahl	546
Maße	150 × 220 × 10 mm · 771 g
Redakteur	Ao, Sio-Iong
Redakteur	Gelman, Len
Redakteur	Yang, Gi-Chul