BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage - Woodhead Publishing Series in Electronic and Optical Materials - Hu, Chenming (Professor Emeritus, University of California, Berkeley, CA, USA) - Bücher - Elsevier Science Publishing Co Inc - 9780323856775 - 3. Mai 2023
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BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage - Woodhead Publishing Series in Electronic and Optical Materials

Hu, Chenming (Professor Emeritus, University of California, Berkeley, CA, USA)

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BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage - Woodhead Publishing Series in Electronic and Optical Materials

BSIM-BULK compact model is the most recent industry standard model of the MOS transistor. It is used by the semiconductor industry as well as academicians and researchers for designing analog, RF, and logic circuits. While the model is commercially integrated into all major integrated circuit simulators, literature on model derivation, physical and numerical approximations are limited.

In BSIM-BULK, the developers provide in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures addressing geometrical scaling, temperatures, etc. There is a dedicated chapter on extensive quality testing procedures and experimental results.

Those working in the semiconductor industry often run into variety of problems like model non-convergence or non-physical simulation results. This is largely due to limited understanding of the internal operations of the model as the literature in the form of technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed. BSIM-BULK discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia.
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325 pages, Approx. 200 illustrations (200 in full color); Illustrations, unspecified

Medien Bücher     Taschenbuch   (Buch mit Softcover und geklebtem Rücken)
Erscheinungsdatum 3. Mai 2023
ISBN13 9780323856775
Verlag Elsevier Science Publishing Co Inc
Seitenanzahl 270
Maße 229 × 152 × 19 mm   ·   454 g
Sprache Englisch  

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