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Semiconductor Advanced Packaging John H. Lau 2021 edition
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Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| Medien | Bücher Taschenbuch (Buch mit Softcover und geklebtem Rücken) |
| Erscheinungsdatum | 19. Mai 2022 |
| ISBN13 | 9789811613784 |
| Verlag | Springer Verlag, Singapore |
| Seitenanzahl | 498 |
| Maße | 157 × 236 × 31 mm · 800 g |
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