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Nicht verfügbare Artikel anzeigen
Releases von
John H. Lau
Gebundenes Buch
Flip Chip, Hybrid Bonding, Fan-I...
(2024)
John H. Lau
€ 160,99
Kaufen
Taschenbuch
2023 edition
Chiplet Design and Heterogeneous...
(2024)
John H. Lau
€ 123,99
Kaufen
Gebundenes Buch
2023 edition
Chiplet Design and Heterogeneous...
(2023)
John H. Lau
€ 169,99
Kaufen
Taschenbuch
2021 edition
Semiconductor Advanced Packaging
(2022)
John H. Lau
€ 114,99
Kaufen
Taschenbuch
2020 edition
Assembly and Reliability of Lead...
(2021)
John H. Lau
€ 109,99
Kaufen
Gebundenes Buch
2021 edition
Semiconductor Advanced Packaging
(2021)
John H. Lau
€ 151,49
Kaufen
Gebundenes Buch
2020 edition
Assembly and Reliability of Lead...
(2020)
John H. Lau
€ 151,49
Kaufen
Gebundenes Buch
2019 edition
Heterogeneous Integrations
(2019)
John H. Lau
€ 151,49
Kaufen
Taschenbuch
Softcover Reprint of the Original 1st 2018 edition
Fan-Out Wafer-Level Packaging
(2018)
John H. Lau
€ 105,49
Kaufen
Gebundenes Buch
2018 edition
Fan-Out Wafer-Level Packaging
(2018)
John H. Lau
€ 142,49
Kaufen
Taschenbuch
Softcover reprint of the original 1st ed. 1991 edition
Solder Joint Reliability: Theory...
(2014)
John H. Lau
€ 193,49
Kaufen
Gebundenes Buch
1994 edition
Chip on Board: Technology for Mu...
(1994)
John H. Lau
€ 219,99
Kaufen
Gebundenes Buch
1992 edition
Handbook Of Tape Automated Bonding
(1992)
John H. Lau
€ 193,49
Kaufen
Gebundenes Buch
1991 edition
Solder Joint Reliability: Theory...
(1991)
John H. Lau
€ 219,99
Kaufen
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Taschenbuch) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-taschenbuch&class=scaled&v=1722057566)
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Gebundenes Buch) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-gebundenes-buch&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Taschenbuch) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-taschenbuch&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Taschenbuch) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-taschenbuch&class=scaled&v=1622167029)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Gebundenes Buch) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-gebundenes-buch&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Gebundenes Buch) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-gebundenes-buch&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Gebundenes Buch) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-gebundenes-buch&class=scaled&v=1588376885)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Taschenbuch) [Softcover Reprint of the Original 1st 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/660/9789811342660.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-taschenbuch&class=scaled&v=1588376983)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Gebundenes Buch) [2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-gebundenes-buch&class=scaled&v=1588376972)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Taschenbuch) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-taschenbuch&class=scaled&v=1516985150)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Gebundenes Buch) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-gebundenes-buch&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Gebundenes Buch) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-gebundenes-buch&class=scaled&v=1516985150)